Senior RF Design Engineer with experience of behavioral, circuit, and electromagnet simulation required by market-leading high-tech mulitnational in Dublin city centre. 

 

Responsibilities:

  • Coordinate and collaborate integration activities with a diverse, cross-functional team of engineers from ideation and conceptualization through high-volume production
  • Design (synthesize and simulate) multi-layer laminates with printed circuits, die, and surface mount components in over-molded and shielded modules. This includes EM co-simulation of critical blocks from a diverse set of functional blocks, materials, and technologies
  • Debug, tune, and optimize prototype hardware
  • Validate performance and producibility through measurements and statistical analysis
  • Document design deliverables to produce prototypes, conduct cross-functional design reviews, and communicate status, progress, and results to internal and external customers
  • Contribute knowledge to the design community that continually improves design processes and tools
  • Contribute intellectual property to the organization that can be reused to provide value for internal and external customers

Requirements:

  • Bachelor’s Degree in Electrical / Electronic Engineering
  • 5 years experience with RF Design
  • Experience and proficiency with CAD tools from Ansys, Cadence, and Keysight, especially ADS, Momentum, FEM and HFSS preferred
  • Experience and proficiency in behavioral, circuit, and electromagnet simulation of complex systems including co-simulation of critical circuit blocks in a diverse palette of technologies (soft-substrates, LTCC, LiTaO3, LiNbO3, CMOS, SiGe, SOI, GaAs, GaN, pHEMT, etc.) preferred
  • Experience and proficiency in RF concepts such as impedance/noise/power matching, impedance transformations, passive networks both lumped and distributed, resonant circuits, large-signal power, noise, linearity, bandwidth, and stability
  • Experience and proficiency in integrating digital, analog, and RF multi-chip modules utilizing wire bond, flip-chip, and surface-mount technologies in single and dual-sided packages (LGA, DSMBGA)
  • Strong, fundamental understanding of RF signals and systems for licensed and unlicensed spectrum standards, especially in Cellular, Bluetooth, WiFi, and the IoT
  • Strong, fundamental understanding of metrology, lab instrumentation, test methods, and measurements, especially for cellular regulatory, carrier, and customer certification
  • Strong, fundamental understanding of electronics and semiconductor packaging from an electrical, mechanical, and thermal perspective, especially with respect to materials, fabrication, processing, and assembly
  • Self-motivated, self-starter comfortable and confident operating in a fast-paced environment
  • Critical thinker with systematic and resourceful problem-solving skills

  

emer@emtechrecruitment.ie

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